Usually in semiconductor production process, we use an inverted bill of materials (IBOM). A wafer in the inverted bill of materials can become multiple different finished goods instead of multiple parts in a bill of materials all coming together to be built into a finished good. The screenshot below shows the inverted bill of materials […]
A Traditional BOM in Tensoft SemiOps
Semiconductor manufacturing typically requires a “one-to-many” production process where wafers move to die, and die are then moved through multiple assembly and packing processes to provide multiple outcomes from a single wafer. This is achieved in Tensoft SemiOps through an inverted BOM (Bill of Materials) model. An inverted BOM is an essential feature for systems […]